The third-generation semiconductor industry competition deepens: SiC shocks promote GaN vertical integration and accelerates layout

This article cooperates with the Tuojian Academic Industry Research Institute, and the content of the reprint is partially refined. If you want to buy a complete report, please contact the Tuojian Academic Official Website This article will show you...


This article cooperates with the Tuojian Academic Industry Research Institute, and the content of the reprint is partially refined. If you want to buy a complete report, please contact the Tuojian Academic Official Website

This article will show you the following: GaN technology will continue to deepen and expand its application scope. GaN semiconductors are developing towards higher integration, including 5G/6G communication base stations and aerospace systems. GaN component demand will grow significantly. The global GaN power semiconductor market is estimated to be 750 million US dollars in 2025, which is 62.7% higher than 2024, and the scale will reach 4.38 billion US dollars by 2030, with a CAGR of approximately 4.38 billion US dollars. 42.3%, reflecting that its growth energy is surpassing traditional silicon-based and SiC materials.

This article will bring you an idea: GaN technology will continue to deepen and expand its application scope to expand the development trend of GaN semiconductors towards higher integration

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